Alkali Cleaning Additive
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1. Low hydrogen peroxide Consumption
Organic compounds and silicon wafer surface impurities can be removed under extremely low hydrogen peroxide dosage conditions
2. Consumption reduction
No need to replenish alkali during the experiment, while significantly reducing the consumption of H2O2
3. Stronger cleaning effect
Enhance the cleaning effect of the system, with no residual components and optimized yield
4. Wide applicability
Can be applied to the pre - and post cleaning processes of different wet process stages
Organic compounds and silicon wafer surface impurities can be removed under extremely low hydrogen peroxide dosage conditions
2. Consumption reduction
No need to replenish alkali during the experiment, while significantly reducing the consumption of H2O2
3. Stronger cleaning effect
Enhance the cleaning effect of the system, with no residual components and optimized yield
4. Wide applicability
Can be applied to the pre - and post cleaning processes of different wet process stages
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